Sales and Support

781-404-6500

Contact Us

info@sensera.com

Investors

Learn More

Bonding

Wafer to wafer bonding for package solutions to match device operating environments

Wafer Bonding

Bonding has become a much-needed process in the development of 2D and 3D MEMS devices. It is a process not only integrate different wafers but also provide a protection to fragile MEMS structures. Sensera can provide aligned bonding to create Wafer Level Packaging (WLP) solutions. Unlike the traditional packaging process, WLP is a technology to package dice while they are still on the wafers. This allows customers to reduce their chip size and it will also be easier to test chip functionality afterward.

Sensera’s experience in metallic and anodic bonding can assist meeting your hermetic WLP sealed device requirements. Specifically, Sensera provides:

  • Silicon fusion bonding
  • Au-Si eutectic bonding
  • Anodic bonding
  • Thermo-compression bonding
  • Adhesive bonding
  • Bonding in controlled ambient/vacuum Wafer Bonding Capabilities

Capabilities

Design for Manufacturing

Lithography

Etching

Deposition

Bonding

Dicing

Metrology

Micro Assembly

Bringing custom devices from concept to market

Contact Us Today