Subtractive process that removes undesired material to create the desired structure
Etching is a critical process to transfer customer design to wafers after the Lithography process. Specifically speaking, it is a process to selectively remove the materials on wafers, which allows us to accurately produce the pattern and the structure that fulfills customer requirements. Sensera is capable of Dry Etching and Wet Etching. By using the most suitable way of etching, we can transform customer design from concept to product.
Possessing advanced equipment including Deep Reactive Ion Etching machine (DRIE) and more, Sensera can perform the etching process with high selectivity, which allows us to build more complex structures for customer devices. Sensera has achieved a high aspect ratio of 50 in MEMS process and fulfilled the most challenging customer requirements. Specifically, Sensera provides:
- Deep Reactive Ion Etching (DRIE) “tuned” for MEMS with 50:1 aspect ratio
- Oxide ICP & RIE etching for SiO2, Si3N4
- Polysilicon etching
- Polymer etching/stripping
- Wet silicon, metal, & dielectric etching