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info@sensera.com

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Capabilities Overview

Sensera operates a MEMS wafer fab and assembly cleanrooms offering a broad range of equipment and material capabilities including Lithography, Etching, Deposition, Bonding, Dicing, Metrology, and Micro Assembly. Through the Design for Manufacturing, Sensera can integrate the capabilities and transform custom devices from concept to product that meet customer specifications in a minimal time.

Capabilities

Design for Manufacturing

Lithography

Etching

Deposition

Bonding

Dicing

Metrology

Micro Assembly

Bringing custom devices from concept to market

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