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Process and Material Capabilities

Sensera operates a MEMS wafer fab and assembly cleanrooms offering  a broad range of equipment and material capabilities including sub-micron Lithography, Plasma Etching, Wet Etching, Metallization, Metrology, Testing, Wafer Bonding, Dicing and fiber optic and electro optic micro assembly.

  • Deep Reactive Ion Etching (DRIE) “tuned” for MEMS with 50:1 aspect ratio
  • Oxide ICP & RIE etching for SiO2, Si3N4
  • Wet silicon & dielectric etching
  • Sputter Deposition of Al, Au, Cr, Cu, NiCr, Ti, TiW
  • Evaporation of Au, Cr, Pt, Ti
  • Front/back Contact Align
  • ASML Stepper 5:1 Aligner
  • Positive and Negative resists
  • Wafer Bonding
  • Wafer Dicing
  • Automated Probing
  • CD Microscopes, SEM
  • Surface Profiler
  • Film Stress Measurements
  • Fiber Optic and Electro Optic micro-assembly

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