Fabrication Facility

Let Sensera Speed You To The Market

Physical Structure

  • Wafer fab is 4000 sq ft,
  • Class 100 and Class 1000 spec. Fab operates better than spec.
  • 11 air handlers delivering up to 60,000 CFM through 102 HEPAs – Laminar air flow with sidewall return
  • Up to 400 air changes per hour in Class 100 space & 100 changes per hour in Class 1000 space
  • Raised floors in Class 100 space to increase operational efficiency and allow better space utilization
  • Utilities (with capacities) include: DI water (220 ga/day), Process Chilled Water (100 gpm), RF Wafer (23 gpm), N2 (800 ga micro-bulk tank), Compressed Air (35k c/f/d)
  • Service chase design optimized to support equipment, chemicals and personnel

Capacity/Capability

  • 5000 150MM wafers per year on 3 shifts. Capable of doubling within space with additional investment
  • Tools include wet & dry (plasma) etching, deposition, automated testing, super critical cleaning, coat/develop, metrology (future: contact aligner and stepper)

Quality Systems

  • All equipment has process logs (on-line & at-station) and maintenance logs
  • SPC, PFMEA, Process Routes, Process Control Plans & Gauge Capability methods deployed
  • Policy & Procedures for access & tool use

Sensera offers the following micro-fabrication process capabilities:

Manufacturing is generally done on silicon or glass substrates.  Manufacturing and development is conducted in accordance with an ISO 9001:2015 compliant quality system.

PROCESSING PACKAGING METROLOGY
Anisotropic Silicon Etch Automated Wafer Dicing Automated Electrical Wafer Probe
High Selectivity Deep Reactive Ion Etch Epoxy and Solder Die Attachment Film Stress Measurement
Metal Wet Etch Anodic and glass frit wafer bonding Surface Profilometry
Dielectric Wet Etch Critical Dimension Analysis
Oxide Inductively Coupled Plasma Etch Scanning Electron Microscopy
Ion Beam Etch
Front & Backside Contact Aligner
i-line Stepper Photolithographic
e-Beam Lithography
Metal Sputter Deposition
Evaporation Deposition
Atomic Layer Deposition
Plasma Enhanced Chemical Vapor Deposition
Superhydrophobic and Oleophobic Coating
Sensera’s Quality System integrates Process Control Planning, Gauge Capability, Statistical Process Control and Process Failure Mode Effects Analysis (pFMEA) for both development and manufacturing

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