Transfer the design pattern from reticles to wafers at sub-micron level
Lithography is a fundamental process to define the routing and control the Critical Dimension (CD) for customer devices. Operating FAB at Class 100, Sensera perfectly controls the temperature and humidity for the Lithography process to ensure we can consistently provide high-quality output. Furthermore, Sensera can transfer customer designs into micron/nano patterns on wafers, which allows customers to build more complex devices.
Sensera performs the lithography process with high accuracy by utilizing a 5X reduction stepper machine from the leading maker ASML with a resolution of less than 1μm. Insisting on delivering products that meet customer requirements, we can produce customer devices with tight CD and overlay controls from layer to layer. Specifically, Sensera provides:
- ASML 5X reduction stepper with .5μm resolution
- Contact 1:1 aligner with front to back alignment capability
- Positive and negative resists with resist thickness < 1-40 μm
- Polyimide coating in the range of 2-55 μm