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Optical MEMS Solutions

Integrating MEMS units and micro-optics into electronics can create many advantages, for example, faster sensing operations. With the advantages, optical MEMS is applied to data transmission, new sensing solutions, etc. It becomes essential for the optics industry.

Having years of experience in MEMS manufacturing, Sensera is able to adopt new technologies and merge MEMS units with micro-optics to provide better solutions to customers. Micromirror arrays are one of the devices that we successfully developed. These micron-scaled mirrors are applied to telecommunication devices and Light Detection and Ranging (LIDAR) applications. Optical MEMS normally requires high quality in surface roughness and wafer-level packaging. Our goal is to provide integrated solutions to bring your design from concept to market.

Optics

  • Micromirror arrays for telecommunications / LIDAR
  • Fiber / electro-optic assemblies
  • Infrared emitters

Automotive LIDAR

Optical Pressure Sensors

Surface Roughness

Surface roughness is one of the important features of optical MEMS because the surface that acts as a part of the optical path needs to be built under high-quality process and tight control.

Surface Roughness

Surface roughness is one of the important features of optical MEMS because the surface that acts as a part of the optical path needs to be built under high-quality process and tight control.

  • Deposition: Sensera provides the Deposition process to create thin films with good thickness uniformity. With extensive experience and knowledge in material science, Sensera is able to deposit various metal and dielectric layers on substrates to fulfill the requirements and enable the functionalities of your devices.
  • Metrology: Sensera has a variety of equipment to perform the Metrology process. By measuring surface profile, film stress, and more, Sensera is able to monitor surface properties during the process. Other critical parameters including Critical Dimension (CD), electrical properties, etc., are also monitored during production in order to allow us to precisely control the quality of customer devices.

Wafer-Level Packaging

Packaging solutions become an important requirement of optical MEMS when the market attempts to lower the cost for optical systems. Wafer-Level Packaging (WLP) is a solution to drive the cost down because of economies of scale.

Wafer-Level Packaging

Packaging solutions become an important requirement of optical MEMS when the market attempts to lower the cost for optical systems. Wafer-Level Packaging (WLP) is a solution to drive the cost down because of economies of scale.

  • Bonding: Sensera offers aligned Bonding to create WLP solutions. Through the process, dice are packaged while they are still on the wafers, allowing customers to reduce the chip size and packaging cost at the same time. The bonding process is not only a packaging solution but also a method used to create multiple layers to fulfill customer requirements.

Bringing custom devices from concept to market

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