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Overview

Wafer-scale processing and assembly based on MEMS and MicroDevice Technologies.

Enabling the development and commercialization of sensors, actuators and three-dimensional structures applied in multiple market verticals.

  • Class 100, 1,000 and 10,000 cleanrooms for wafer processing and fiber optic and electro-optical micro assembly
  • Technical staff with extensive experience in material science, MEMS and semiconductor process development, prototyping and volume production.
  • Extensive analytical, metrology, and test capabilities.
  • QMS driven process development and manufacturing.
  • ISO 9001:2015
  • Flexibility to develop and bring in new technologies

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