Automated mechanical dicing for die singulation
Sensera provides automated mechanical dicing service with various dicing width and programmable die size setting for wafers and wafer stacks. Sensera has developed solutions to maintain device integrity and cleanliness throughout the singulation process. This enables us to provide the dicing service with high dicing yield and reduce the risk of low wire bonding strength and reliability due to silicon dust residue generated from the dicing process.
Sensera also provides solutions for partial layer dicing to expose device wafer bond pads and facilitate wafer level probing after bonding. Our dicing process is adaptable to different die size and shape as well. Dice are typically rectangular or squared-shaped. Nevertheless, Sensera can saw dice into custom shapes to fulfill customer requirements and bring your design from concept to market.